Dow Corning® EA-7100 For Electronic & Automotive Applications

Dow Corning® has demonstrated time after time its endearing qualities as a global leader in adhesive silicone adhesive technology and products; the company has done it again with the introduction of its new Dow Corning® EA-7100 Thermal Radical Cure (TRC) Adhesive. With its 2015 nominations for the prestigious R&D 100 Award in both the Market Disrupter category and the Mechanical Devices/Materials category, Dow’s new TRC adhesive promises to offer “game-changing benefits” to its customers in the transportation electronics sector.

Car abstract concept

Among the potential applications for this breakthrough in adhesive technology are the assembly of electronics housings, the attachment of connectors, electronic control units (ECUs), lighting and display modules, or sensors, to an unprecedented variety of substrates.

A BREAKTHROUGH IN ADHESION AND CURE TIME

The list of materials that EA-7100 has demonstrated compatibility with include metals such as aluminum, brass, copper, and steel, as well as ceramics, glass, laminates, silicones and plastics that typically haven’t had good cohesive adhesion properties. Compatibility is possible with polymer plastics such as polycarbonates and polyethylenes (including LDPE and PEX), Nylon, acetal plastics, Plexiglass®, PVC, liquid crystal polymers, and cured silicones; often without pretreatment or specialized cleaning. Dow indicates that it expects this list to continue to grow as new applications are developed and tested, and there is no doubt that robust adhesion to such a diverse range of materials will enable new product designs that may revolutionize the manufacturing of automotive electronics.

The unique ability to bond to so many substrates magnifies the overall performance of TRC adhesives when presented with their low voiding and significantly reduced cure time compared to conventional heat-cure, platinum catalyzed silicone adhesive systems. The adhesive has demonstrated the ability to achieve a full cure in as little as 15 minutes at 100°C compared to the longer 60 minute cure time of conventional single-part, addition-cure adhesives at 125°C. In some applications, cohesive adhesion begins in as little as 3 minutes, a quality that, along with lower cure temperatures, is sure to increase production efficiency in the manufacture of transportation and automotive electronics products. This highly effective curing process yields lower energy use and lower material processing costs.

A NEW KIND OF CURE

With the onset of cohesive adhesion occurring in as little as 3 minutes, Dow Corning’s EA-7100 can cure to a wide range of substrates simultaneously. Curing and adhesion begin before skin-over, in bulk, and at the bond line, and 100% adhesion is achieved immediately after cure time. While the adhesive surface exposed to oxygen remains tacky until its dual cure system is completed, the cohesive adhesion allows for immediate hot testing, and surface tack can be reduced by curing the adhesive in a low oxygen oven.

Typical “addition cure” silicone adhesives have shown sensitivity to certain contaminants such as amines or sulfur, that interfere with bonding, but EA-7100 has proven to be unaffected by either. As a thixotropic adhesive with reduced viscosity under agitation, it requires neither extensive cleaning before application nor pre-treatment in most cases. With little to no cleaning or pre-treatment required, primers, plasma, and UV or corona processes can be reduced and possibly eliminated in some applications, another cost reducing benefit.

ENHANCED ADHESIVE PERFORMANCE

What does it take for a high-performance silicone adhesive to claim the title “high performance?” It’s more than just versatility among a variety of applications and substrates, lower cure temperatures, and less cure time; it also requires enhanced adhesive properties. Properties such as adhesion, shear, tensile strength, resistance to corrosion, and superior reliability under water immersion and salt water spray environments make Dow Corning EA-7100 stand out as a high-performance adhesive.

EA-7100 shows adhesion strength up to 350 PSI to aluminum substrates, while adhesion to PBT thermoplastics such as Ticona® and BASF® is even higher; up to 380 PSI at 100% cure. With a Shore A durometer hardness of 43, it’s tensile strength is a whopping 490 PSI, and its shear strength on aluminum and PBT substrates is over 350 PSI (after only 30 minutes of cure time).

GREATER DESIGN FLEXIBILITY AND COST CONTROL

Dow Corning EA-7100 Adhesive was developed to give manufacturers of automotive electronics and electronics modules greater design flexibility and cost control. This innovative one-part thixotropic adhesive technology widens the possibility for new, improved models with more superior performance potential and more cost control than previously available for applications in automotive and transportation electronics.

Durable adhesion to a wide range of substrates is formed simultaneously with the cure, increasing the flexibility of new product designs. Both faster cure times and lower cure temperatures increase production efficiency and reduce energy costs. Small void formation, reduced sensitivity to contaminants, and improved adhesion in harsh environments including hot and cold temperature extremes, salt spray exposure, as well as both fresh and saltwater immersion also enhances new design possibilities.

MORE APPLICATION POSSIBILITIES

The opportunities for applications in the manufacturing of transportation and automotive electronics are as diverse as can be expected for a Dow Corning adhesive product. EA-7100 can be considered for a variety of uses in the assembly of plastic and metal electronics housings and components, as well as for attaching electrical connectors, lighting components, and sensors to a wide range of substrates.

Possibilities for powertrain applications in the electronic management of engine performance and emissions, control of automatic gearboxes, and in the management of power steering and braking functions include various ICU modules and sensors that can benefit from this new adhesive technology. Safety and driver assistance sensors and controls such as those used with airbags, crash detection, tire pressure monitoring, adaptive lighting, and speed control functions would also benefit from this innovative adhesive technology. There are numerous applications in driver and occupant comfort, climate control, power accessories, and power distribution as well. Contact the Robert McKeown Company at solutions@robertmckeown.com or 800.631.1125 to discuss your application with one of our in house engineers.

About Dow Corning

Dow Corning is a global leader in innovation of adhesive, sealant, and silicone technologies that include more than 7000 individual products and services. With more than 25,000 corporate customers worldwide, Dow Corning offers innovative products and solutions for a diverse range of industries, manufacturing, and service sectors.

Experience the Product’s Performance First-Hand

For a sample of EA-7100, or to learn more call the Robert McKeown Company at 800.631.1125 or email solutions@robertmckeown.com

Henkel Adhesives Deliver for Wearable Electronics

From smart watches to user interface glasses, wearable electronics are on the edge of technology allowing consumers to take their smart gadgets on the go. As the demand for mobility rises, devices get smaller and the technology to manufacture them continues to advance and evolve. The rigorous demands of wearable electronics are keeping adhesive technology at the forefront of innovation.

Henkel Adhesives Deliver for Wearable Electronics

HENKEL ADHESIVES PROVIDE HIGH-PERFORMANCE SOLUTIONS

Wearable electronics demand requires performance and reliability under the most adverse conditions. Exposure to shock, stress, vibration, extreme temperatures, and water/moisture can’t be allowed to affect performance and reliability. In this rapidly growing market where less is more, there is no place for bulky adhesive products on devices where size and limitations are crucial. Manufacturers of wearable technology depend on Henkel for the adhesive solutions they need to take their complex products from the design table to the production line.
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Robert McKeown Co. Hosts TECHNOMELT™ Workshop

Join us Tuesday, June 28, 2016 at 10 a.m. for a TECHNOMELT™ Low Pressure Molding Adhesive & Technology Workshop featuring LPMS USA and Henkel Electronics.

Technomelt WorkshopAt the workshop, you’ll learn how to cut costs, improve manufacturing efficiency and offer a one-step molding alternative to your customers.

Michael Pierce Henkel will speak on their full line of TECHNOMELT™ materials with focus on the new thermally conductive TC 50 and PA 668 materials. Rob Michael will review the key innovations of their line of low pressure molding equipment and will provide demos with the Beta 600 as well.

The TECHNOMELT™ family of low pressure molding solutions address demanding protection against solvents, moisture and chemicals, high temperatures and adhesion to multiple types of substrates. Henkel’s TECHNOMELT™ materials are fast, simple, and efficient with each molding operation enduring a short cycle time (30-60 seconds) at low pressure.
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Custom Services For High Tech Electronics Assembly

Robert McKeown Company, Inc. prides itself on providing a myriad of custom assistance services and products such as:

We Specialize in Short-Run and Quick Turn-Around!

X-Y Parts Cutter, Clicker Steel Rule Die Cutting, Rotary Die Cutting of custom and standard Electronic Component Assembly Parts, Epoxy Film Adhesives, Gaskets, Thermal Interface Adhesive Parts, EMI/ESD Shields, Dupont™ Kapton® Solder Masking Dots, Conformal Coating Masking Dots, Powder Coating & Painting Masking Dots as well as Pressure Sensitive adhesive backing for Industrial, Electronics, Aerospace, Mechanical, Mil-Aero and Flat Plastic Parts applications.

X.Y. Laser Converting

The X.Y. laser converting system is one of the top systems available. The continuous and automatic device increases as it goes, removing parts from the sheet with almost no material limitations. This system can increase productivity, with defect-free and tool-free cutting. X.Y. laser converting can also eradicate layout limitations and reduce scrap material costs all while reloading jobs in no time and providing a consistent cut-to-print registration.

X.Y. Laser Converting
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Loctite Ablestik SSP 2020

LOCTITE introduces ABLESTIK SSP 2020. An Ag-based material that delivers a robust intermetallic bond between targeted surfaces, the substrate and die, via a pressureless or pressure sintering process. This solution, ideal for high power devices, facilitates much higher thermal and electrical conductivity than traditional die attach adhesives and has performance equivalent or better than solder — all while meeting the stringent requirements of lead-free legislation. The technical staff at the Robert McKeown Company is available to assist you with integration of SSP 2020 into your manufacturing process.

LOCTITE ABLESTIK SSP 2020
is a sintering silver paste die attach adhesive designed for devices requiring elevated thermal and electrical conductivity capabilities. It is formulated to provide high heat transfer generated from power devices. It maintains high adhesion at operating temperatures as high as 260°C. It is stencil printable and syringe dispensable.

  • Ideal for high power devices
  • Delivers a robust intermetallic bond between targeted surfaces
  • Facilitates much higher thermal and electrical conductivity than traditional die attach adhesives
  • Provides strong adhesion
  • Compatible with current production equipment, high throughput
  • 10x thermal cycle & power cycle performance better than solder

Loctite Ablestik SSP 2020
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Henkel Loctite GC10

Henkel Loctite GC10 is the industry’s first temperature stable solder paste. GC10 is stable at 26.5 degrees Celsius for one year and at temperatures of up to 40 degrees Celsius for one month. This temperature stability provides tremendous benefits throughout the logistics and operations chain.

Click here to download a PDF copy of the Henkel Loctite Game Changer 10 Specifications

In production, Henkel Loctite GC10 offers huge improvements over conventional solder pastes in printed circuit board assembly. As compared to traditional materials which average abandon times from 1 to 4 hours, this halogen-free, lead-free, temperature-stable formula enables abandon time of up to 24 hours and has a startup time of zero. Stabilized and consistent print transfer efficiency, an expanded reflow window and increased activity for better results with soak temperatures between 150 degrees C and 200 degrees C, make Henkel Loctite GC10 incomparable among solder pastes. And, GC10’s dependability on the line yields material utilization of over 95%.

Henkel Loctite GC10
By using Henkel Loctite GC10 the Robert McKeown Company offers its customers both process improvements and cost reductions. The temperature stability of this product will eliminate the challenges with shipping and storage. GC10 is setting a new standard for high performance solder materials with improvements in production, higher yields and ultimately better profitability.

For a sample of Henkel Loctite GC10 or to speak with a technical specialist call 800.631.1125 or email sales@robertmckeown.com
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