Month: May 2016
Join us Tuesday, June 28, 2016 at 10 a.m. for a TECHNOMELT™ Low Pressure Molding Adhesive & Technology Workshop featuring LPMS USA and Henkel Electronics.
Michael Pierce Henkel will speak on their full line of TECHNOMELT™ materials with focus on the new thermally conductive TC 50 and PA 668 materials. Rob Michael will review the key innovations of their line of low pressure molding equipment and will provide demos with the Beta 600 as well.
The TECHNOMELT™ family of low pressure molding solutions address demanding protection against solvents, moisture and chemicals, high temperatures and adhesion to multiple types of substrates. Henkel’s TECHNOMELT™ materials are fast, simple, and efficient with each molding operation enduring a short cycle time (30-60 seconds) at low pressure.